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| Mfg Part Number: 10337 | NSN : 5961-01-023-9967 | NIIN : 010239967 |
| CAGE Code : 74006 | Manufacturer: Reliance Comm Tec Corp | Item Name : Semiconductor Devic |
| FSC : 5961 Semiconductor Devices and Associated Hardware |
Aviation Gamut, owned and operated by ASAP Semiconductor, is an all-inclusive purchasing platform for hard-to-find and in-demand parts 10337 and components pertaining to the civil aviation, defense, aerospace, industrial, and electronic markets. An NSN is a 13-digit numeric code that serves to identify 'standardized material items of supply' as they have been recognized by all NATO countries and the United States Department of Defense. As such, we have an inventory of more than two billion new and obsolete parts, among which is an unparalleled selection of NSN parts and much more. This includes items such as Semiconductor Devic 10337 from manufacturer Reliance Comm Tec Corp and many more, all of which are available with short lead times and competitive prices. For NSN parts, Aviation Gamut is the ultimate source.
Our website offers a number of parametric search capabilities, one of which allows you to search specifically for 10337. This means you can quickly sort through National Stock Numbers such as 5961010239967 and find parts from quality manufacturers like Reliance Comm Tec Corp and many others. To begin the purchasing process immediately, submit an RFQ today. Our team of dedicated account managers is standing by and will respond to all inquiries in 15 minutes or less.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-023-9967 Item Description: Semiconductor Devic | 5961 | 010239967 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | U | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 10337 | 5 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 0.160 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| ADAV | OVERALL DIAMETER | 0.305 INCHES MINIMUM AND 0.335 INCHES MAXIMUM |
| ALAS | INTERNAL CONFIGURATION | JUNCTION CONTACT |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTMZ | III SEMICONDUCTOR MATERIAL | SILICON |
| FEAT | SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: PNPN |
| TTQY | TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |
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