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| Mfg Part Number: T4700B | NSN : 5961-00-138-5025 | NIIN : 001385025 |
| CAGE Code : 54590 | Manufacturer: Rca Corp | Item Name : Semiconductor Devic |
| FSC : 5961 Semiconductor Devices and Associated Hardware |
Aviation Gamut, owned and operated by ASAP Semiconductor, is an all-inclusive purchasing platform for hard-to-find and in-demand parts T4700B and components pertaining to the civil aviation, defense, aerospace, industrial, and electronic markets. An NSN is a 13-digit numeric code that serves to identify 'standardized material items of supply' as they have been recognized by all NATO countries and the United States Department of Defense. As such, we have an inventory of more than two billion new and obsolete parts, among which is an unparalleled selection of NSN parts and much more. This includes items such as Semiconductor Devic T4700B from manufacturer Rca Corp and many more, all of which are available with short lead times and competitive prices. For NSN parts, Aviation Gamut is the ultimate source.
Our website offers a number of parametric search capabilities, one of which allows you to search specifically for T4700B. This means you can quickly sort through National Stock Numbers such as 5961001385025 and find parts from quality manufacturers like Rca Corp and many others. To begin the purchasing process immediately, submit an RFQ today. Our team of dedicated account managers is standing by and will respond to all inquiries in 15 minutes or less.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-00-138-5025 Item Description: Semiconductor Devic | 5961 | 001385025 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | U | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| T4700b | 2 | 1 | C | A |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | METAL |
| ABHP | OVERALL LENGTH | 1.252 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.340 INCHES MAXIMUM |
| ABMK | OVERALL WIDTH | 0.700 INCHES MAXIMUM |
| AKPV | MOUNTING FACILITY QUANTITY | 2 |
| ALAS | INTERNAL CONFIGURATION | JUNCTION CONTACT |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-66 |
| AXGY | MOUNTING METHOD | UNTHREADED HOLE |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTMZ | III SEMICONDUCTOR MATERIAL | SILICON |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 200.0 MAXIMUM REPETITIVE PEAK OFF-STATE VOLTAGE |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 AMPERES PEAK FORWARD SURGE CURRENT ABSOLUTE |
| CTRD | POWER RATING PER CHARACTERISTIC | 16.0 WATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR BLANK |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 100.0 DEG CELSIUS CASE |
| FEAT | SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: PNPN |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 PIN AND 1 CASE |
 |
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