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| Mfg Part Number: HM5-6564-9 | Alternate P/N: HM565649 | NSN : 5962-01-178-2798 |
| NIIN : 011782798 | CAGE Code : 1MY79 | Manufacturer: Intersil Communications Inc |
| Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic |
Aviation Gamut, owned and operated by ASAP Semiconductor, is an all-inclusive purchasing platform for hard-to-find and in-demand parts HM5-6564-9 and components pertaining to the civil aviation, defense, aerospace, industrial, and electronic markets. An NSN is a 13-digit numeric code that serves to identify 'standardized material items of supply' as they have been recognized by all NATO countries and the United States Department of Defense. As such, we have an inventory of more than two billion new and obsolete parts, among which is an unparalleled selection of NSN parts and much more. This includes items such as Microcircuit Memory HM5-6564-9 from manufacturer Intersil Communications Inc and many more, all of which are available with short lead times and competitive prices. For NSN parts, Aviation Gamut is the ultimate source.
Our website offers a number of parametric search capabilities, one of which allows you to search specifically for HM5-6564-9. This means you can quickly sort through National Stock Numbers such as 5962011782798 and find parts from quality manufacturers like Intersil Communications Inc and many others. To begin the purchasing process immediately, submit an RFQ today. Our team of dedicated account managers is standing by and will respond to all inquiries in 15 minutes or less.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-178-2798 Item Description: Microcircuit Memory | 5962 | 011782798 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Hm5-6564-9 | 2 | 1 | C | 9 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 2.020 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.890 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.170 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 280.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE AND W/ENABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 28 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 8.3 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 40 PRINTED CIRCUIT |
 |
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