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| Mfg Part Number: 91L02DM-B | Alternate P/N: 91L02DMB | NSN : 5962-01-043-6195 |
| NIIN : 010436195 | CAGE Code : 34335 | Manufacturer: Advanced Micro Devices Inc |
| Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic |
Aviation Gamut, owned and operated by ASAP Semiconductor, is an all-inclusive purchasing platform for hard-to-find and in-demand parts 91L02DM-B and components pertaining to the civil aviation, defense, aerospace, industrial, and electronic markets. An NSN is a 13-digit numeric code that serves to identify 'standardized material items of supply' as they have been recognized by all NATO countries and the United States Department of Defense. As such, we have an inventory of more than two billion new and obsolete parts, among which is an unparalleled selection of NSN parts and much more. This includes items such as Microcircuit Memory 91L02DM-B from manufacturer Advanced Micro Devices Inc and many more, all of which are available with short lead times and competitive prices. For NSN parts, Aviation Gamut is the ultimate source.
Our website offers a number of parametric search capabilities, one of which allows you to search specifically for 91L02DM-B. This means you can quickly sort through National Stock Numbers such as 5962010436195 and find parts from quality manufacturers like Advanced Micro Devices Inc and many others. To begin the purchasing process immediately, submit an RFQ today. Our team of dedicated account managers is standing by and will respond to all inquiries in 15 minutes or less.
| MRC | Criteria | Characteristic |
|---|---|---|
| CZEQ | Time Rating Per Chacteristic | 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | Memory Device Type | RAM |
| AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
| CQZP | Input Circuit Pattern | 13 INPUT |
| ADAT | Body Width | 0.278 INCHES MINIMUM AND 0.298 INCHES MAXIMUM |
| CQSJ | Inclosure Material | CERAMIC AND GLASS |
| TTQY | Terminal Type And Quantity | 16 PRINTED CIRCUIT |
| CWSG | Terminal Surface Treatment | SOLDER |
| CBBL | Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND LOW POWER AND W/STORAGE AND W/DECODED OUTPUT |
| ADAQ | Body Length | 0.770 INCHES MINIMUM AND 0.808 INCHES MAXIMUM |
| AEHX | Maximum Power Dissipation Rating | 260.0 MILLIWATTS |
| ADAU | Body Height | 0.085 INCHES MINIMUM AND 0.124 INCHES MAXIMUM |
| TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| MRC | Decoded Requirement | Clear Text Reply |
| CQSZ | Inclosure Configuration | DUAL-IN-LINE |
| AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
| CQWX | Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEN | Voltage Rating And Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZZZ | Memory Capacity | UNKNOWN |
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